Title:
COOLING MODULE COMPRISING COOLING STRUCTURE FOR DISSIPATION OF HEAT
Document Type and Number:
Japanese Patent JP2022171638
Kind Code:
A
Abstract:
To provide a cooling structure with excellent resistance to thermal shocks, high temperatures, humidity, and high pressures.SOLUTION: An electronic module 10 is designed to be incorporated in an electrical assembly of an electric or hybrid motor vehicle. An alveolar cooling structure 3 is configured to dissipate heat generated by at least one electronic component 40 placed on an upper surface 21 of a substrate 2, and is in contact with a lower surface 22 of the substrate 2. The alveolar cooling structure 3 comprises: cells, the cell edges of which increase a total contact surface between the alveolar cooling structure 3 and a cooling liquid; and pores which are defined by the cells and distributed in the volume of the alveolar cooling structure 3. The cooling liquid circulates through the pores and/or through spaces between the pores.SELECTED DRAWING: Figure 3
Inventors:
VERHOOG ROELOF
Application Number:
JP2022075249A
Publication Date:
November 11, 2022
Filing Date:
April 28, 2022
Export Citation:
Assignee:
VALEO SIEMENS EAUTOMOTIVE FRANCE SAS
International Classes:
H01L23/473; H01L23/36; H05K7/20
Attorney, Agent or Firm:
Takeshi Sekine
Hideyuki Mori
Hideyuki Mori