Title:
COOLING STRUCTURE OF CONDUCTOR CONNECTION PART
Document Type and Number:
Japanese Patent JP2016220317
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide cooling structure of a conductor connection part enabling efficient cooling of the conductor connection part with simple structure at a low cost.SOLUTION: The cooling structure of a conductor connection part is formed by laminating a tabular device side conductor 203 and an external conductor 204 and fastening the conductors 203, 204 with a bolt 211 and a nut 212. The device side conductor 203 and the external conductor 20 are integrally fastened together with the bolt 211 and the nut 212 by engaging a cooling member 210 with excellent heat conductivity on both sides of a flat plate part 210A of which comb-like heat dissipation parts 210B are formed to an upper end part 203A of the device side conductor 203 with an engaging part 210C.SELECTED DRAWING: Figure 2
Inventors:
TAKAHASHI KIYOSHI
Application Number:
JP2015100097A
Publication Date:
December 22, 2016
Filing Date:
May 15, 2015
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H02G5/10; H01F27/28; H01R4/38; H05K7/06; H05K7/20
Domestic Patent References:
| JPS6232517U | 1987-02-26 | |||
| JP2011054778A | 2011-03-17 | |||
| JPH0447335U | 1992-04-22 |
Attorney, Agent or Firm:
Yuichi Morita