Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COOLING STRUCTURE OF ELECTRONIC APPARATUS, AND COOLING SYSTEM THEREOF
Document Type and Number:
Japanese Patent JP2003008275
Kind Code:
A
Abstract:

To perfectly prevent an electronic apparatus from condensing in the inside, at cooling of the electronic apparatus, by utilizing Peltier effect.

A module 2 which is a heating body to be cooled and a Peltier element 3 contacted thereto to cool are disposed inside the frame of an electronic apparatus 1, which shuts off outside air from its interior. The Peltier element 3 contacts the module 2, and its heating side 3a contacts the electronic apparatus frame 9, to exchange heat from the heating side 3a through heat conduction, through a radiator 10 on the frame 9 surface. The electronic apparatus frame 9 is filled with dry air 6 introduced from an intake valve 7. A dew point meter in the electronic apparatus 1 monitors the dew point temperature in the frame, and a controller 4 controls the cooling power of the Peltier element 3, to prevent the dewing in the frame in a dew point temperature range of the dry air 6. Optimum temperature of the module 2 can be set by the controller 4.


Inventors:
FURUTA SHIGEKI
Application Number:
JP2001190180A
Publication Date:
January 10, 2003
Filing Date:
June 22, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC NETWORK SENSA KK
International Classes:
F25B21/02; H01L23/38; H01L35/28; H01L35/30; H05K7/20; (IPC1-7): H05K7/20; F25B21/02; H01L23/38; H01L35/28; H01L35/30
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)