Title:
COOLING STRUCTURE OF ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2021185592
Kind Code:
A
Abstract:
To provide the cooling structure of an electronic component, achieving the efficient cooling of the electronic component arranged in a housing while suppressing the number of a cooling fan.SOLUTION: The inside of an information processing unit is divided into upper and lower two-staged ventilation trunks A, B by a partition plate 7. An intake fan 10 is arranged between the partition plate 7 and a back plate 4, and cooling air taken into the housing 2 by the drive of the intake fan 10 is branched into the upper and lower two-staged ventilation trunks A, B by the partition plate 7. In this case, opening areas of the ventilation trunks A, B on a back plate 4 side are set to satisfy [A:B=4:6]. An electronic component with relatively high heat generation is arranged inside the ventilation trunk A, while a component with relatively low heat generation is arranged inside the ventilation trunk B.SELECTED DRAWING: Figure 5
Inventors:
HASEGAWA TOMOHIRO
SUZUKI AKIRA
SUZUKI AKIRA
Application Number:
JP2020090309A
Publication Date:
December 09, 2021
Filing Date:
May 25, 2020
Export Citation:
Assignee:
MEIDENSHA ELECTRIC MFG CO LTD
International Classes:
G06F1/20; H05K7/20; H01L23/467
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Uzawa Hidehisa
Tomoyuki Ota
Tomioka Kiyoshi
Uzawa Hidehisa
Tomoyuki Ota