PURPOSE: To enable a part where a failure occurs to be maintained without stopping the entire device by providing a plurality of power supplies and a plurality of cooling means corresponding to each of a plurality of multi-chip package modules.

CONSTITUTION: An electronic device control part 2 and a cooling module control part 4 are connected mutually through a signal line 104, having a function for detecting failure of each module and for reporting the failure within the inside. For example, when the module 5-2 of the multi-chip package module(MCP) reaches a high temperature and a failure is detected by the electronic device control part 2, the electronic device control part 2 reports failure to a power supply control part 3 and the cooling module control part 4, stops operation at the MCP module 5-2, a power supply module 6-2, and a cooling module 7-2, and then performs maintenance of the MCP module 5-2, thus enabling the MCP module 5-2 where a failure occurs to be maintained without stopping other MCP modules 5-1, 5-3-5-n, power-supply modules 6-1, 6-3-6-n, and cooling modules 7-1, 7-3-7-n.