PURPOSE: To secure favorable cooling performance by pressing each circular spherical surface that is formed at the pointed end of each fin to semiconductor package structure equipped with a circular spherical surface corresponding to the above spherical surface and flowing a coolant between fins arranged at the inside of a housing.
CONSTITUTION: A plurality of semiconductor packages 3 are loaded on a circuit board 4 and each individual fin 1 is pressed to a semiconductor independently. Respective plates 2D and 2E which construct the outer wall of a housing form the flow path of a coolant and two pieces of bushing 6A and 6B equipped with O-rings 8A and 9A or 8B and 8B assure sealing of the coolant and movability of fins. The pointed end of each fin has a spherical surface and even the surface of each semiconductor package 3 corresponding to the pointed end of the fin is finished to a spherical surface that is well matched to that of the fin. This approach not only absorbs relative inclination of the semiconductor package and the housing but also decreases contact heat resistance.
ZUSHI SHIZUO
MIYAMOTO MITSUO
TAKAHASHI KAZUTOSHI
