PURPOSE: To provide a cooling structure small in size, high in efficiency, and applicable to an electronic part mounted on an electronic device or the like.

CONSTITUTION: Heat released from an integrated circuit device 2 is transmitted to a ceramic board and then conducted to an evaporator 6 of a heat exchanger 5 through the intermediary of an adhesive agent 14. In result, coolant A12 is boiled, evaporated to move upwards, made to come into contact with a cooling section 7, cooled down, and condensed. At this point, a junction heat generated from the integrated circuit device 2 is transmitted to a cooling section 7 through the intermediary of coolant A12 and conducted to coolant B15 from heat dissipating fins 13, wherein coolant B15 makes a convection around the fins 13, and the integrated circuit device 2 is cooled down. On the other hand, coolant A12 cooled down by the cooling section 7 is collected in a coolant reservoir 9 of a distributor 8 from the cooling section 7 and distributed through a distributing pipe 10, and then a cooling cycle is repeatedly carried out in the same way as above.