PURPOSE: To simplify the shape of a cold plate, and to cool each integrated circuit efficiently regardless of the calorific values of each integrated circuit.

CONSTITUTION: Structure, in which the bores of blow-off nozzles are gradually made small to the degree corresponding to integrated circuits by cooling structure, in which a cold plate 6 with the integrated circuits 2 mounted to a substrate 1 a substrate frame 3 holding the substrate and spot facing holes 5 corresponding to the size of a plurality of the integrated circuits, a plurality of the blow-off nozzles 12 straightly directed toward the floor faces of the spot facing holes and exhaust nozzles 13 selecting and discharging a refrigerant from said spot facing holes to a discharging introducing chamber 11 are set up and the refrigerant is forwarded from an intake 8 to an extraction port 9, is formed.