Title:
COOLING STRUCTURE FOR MAIN SPINDLE DEVICE
Document Type and Number:
Japanese Patent JPH0631585
Kind Code:
A
Abstract:
PURPOSE: To provide the coolant structure of a main spindle device which can be cooled uniformly and efficiently without increasing the quantity of parts and without being restrained in design.
CONSTITUTION: A cooling structure for a main spindle device which is equipped with a spindle head (housing) 1 and a main spindle 3 which is axially supported on the spindle head through a roller bearing outer cylinder 9 is constituted. In this case, a spiral groove 16 is formed on the outer surface of the spindle 3, and the space formed from the spiral groove 16 and the inner surface of a bearing inner cylinder 11 is used as coolant flow passage.
Inventors:
WATANABE MICHIO
Application Number:
JP19400592A
Publication Date:
February 08, 1994
Filing Date:
July 21, 1992
Export Citation:
Assignee:
MORI SEIKI SEISAKUSHO KK
International Classes:
B23Q11/12; (IPC1-7): B23Q11/12
Attorney, Agent or Firm:
Tsutomu Shimoichi