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Title:
COOLING STRUCTURE OF HEATING ELEMENT AND POWER CONVERSION DEVICE
Document Type and Number:
Japanese Patent JP2016220383
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a power conversion device in which thermal resistance of a thermal connection part is reduced.CONSTITUTION: A cooling structure of a heating element includes: the heating element having at least one cooling surface formed by protruding a protrusion part; a heat receiving spacer for forming an insertion part into which the protrusion part is inserted; a holding member for pressing and holding the heat receiving spacer and the heating element; and a cooler for cooling the heat receiving spacer. In a fitting state where the heating element and the heat receiving spacer are fitted by the holding member, the distance between the cooling surface and the end surface of the protrusion part is smaller than that between the cooling surface and the surface opposite to the holding member of the heat receiving spacer.SELECTED DRAWING: Figure 9

Inventors:
KONISHI YUICHIRO
MATSUMOTO DAISUKE
Application Number:
JP2015102367A
Publication Date:
December 22, 2016
Filing Date:
May 20, 2015
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
H02M7/48; H01L23/40; H01L23/427; H05K7/20
Domestic Patent References:
JPS6376462A1988-04-06
JP2000060106A2000-02-25
JPH0573961U1993-10-08
JPH0574988A1993-03-26
JPH09213854A1997-08-15
JP2004241553A2004-08-26
Foreign References:
WO2014132399A12014-09-04
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Shigemi Iwasaki