Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COOLING STRUCTURE FOR PRINTED BOARD
Document Type and Number:
Japanese Patent JPH03242997
Kind Code:
A
Abstract:

PURPOSE: To enhance a heat transfer effect between a heat generation source and a heat pipe and to easily manufacture at a low cost by securing the pipe to the rear surface of an insulating board through a heat absorption plate, bringing the pipe into surface contact with the flat absorption plate, and securing it in a state that it is buried in an adhesive layer.

CONSTITUTION: An adhesive layer 4 is superposed on the rear surface of an insulating plate 1 made of glass.epoxy resin laminated plate through a prepreg 2 and a heat absorption plate 3 made of a copper plate as a laminated plate (a). A heat pipe 5 formed of a copper round tube as a container is previously buried by allowing its one end of the same direction to protrude to the side in the layer 4, pressed in its thickness direction while heating the plate (a), and collapsed to manufacture a printed board a'. The pipes 5 are brought into surface contact with the rear surface of the plate 3, the parts of the pipes 5 in contact with the plate 3 become flat tubes, and are secured to the rear surface of the plate 3 by the layer 4. Thus, it can be inexpensively manufactured, a contact heat resistance between the pipes 5 and the heat generated part is small, and heat transfer can be smoothly and rapidly performed.


Inventors:
NODA HAJIME
SOTANI JIYUNJI
KOBAYASHI KENZO
YAMAMOTO MASAAKI
Application Number:
JP4004990A
Publication Date:
October 29, 1991
Filing Date:
February 21, 1990
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
H05K7/20; (IPC1-7): H05K7/20
Domestic Patent References:
JPS56167566U1981-12-11
JPS54124257A1979-09-27