To provide a cooling structure which is possessed of a means of absorbing the distortion of a cooled body after it is mounted and where the cooled body can be easily checked even after the cooling structure is assembled.

A cooling structure 1 is equipped with a cooling part 11, a heat transfer body 12 which is pressed against the cooling part 11 by a force applied by a screw 13 through the intermediary of a flat washer 13e, a wavy washer 13d and a flat washer 13e, and a spring 14 that presses the heat transfer body 12 against an integrated circuit 4 as a cooled body. The wave washer 13d absorbs the vertical distortion of the integrated circuit 4 or a printed board 4a. The heat transfer body 12 is not fixed to the integrated circuit 4 but brought into plane contact with the integrated circuit 4 through the intermediary of thermally conductive grease 16, so that the underside of the heat transfer body 12 slides smoothly on the integrated circuit 4 to absorb the horizontal strain of the integrated circuit 4 or the printed board 4a. Therefore, the cooling structure 1 does not put any load on a cooled body such as the integrated circuit 4 absorbing both the vertical and horizontal strain of the integrated circuit 4 after it is mounted.