To provide a cooling substrate having a flow passage capable of reducing a pressure loss in the flow passage by relatively increasing the cross sectional area of the flow passage at a heat transport side, and suppressing the generation of dryout in a heat absorbing part by relatively reducing the cross sectional area of the flow passage at a return side, easily making a refrigerant in the flow passage flow in one direction and having an improved heat transport capacity.
In the cooling substrate, at least the one heat absorbing part 30 and one heat release part 40 are provided in the substrate 10, and the heat absorbing part and heat release part communicate with each other to form a loop shape by the refrigerant flow passage 50. The refrigerant is circulated in the refrigerant flow passage and heat transport is performed by the evaporation-condensation latent heat of the refrigerant. The refrigerant flow passage comprises a heat transport side flow passage 60 for sending the vaporized refrigerant from the heat absorbing part to the heat release part and a return side flow passage 70 for sending the liquefied refrigerant from the heat release part to the heat absorbing part. The cross sectional area of the return side flow passage is set smaller than that of the heat transport side flow passage.
NAKAMURA TOSHIAKI
KIMURA YUICHI
| JP2004134742A | 2004-04-30 | |||
| JP2005033162A | 2005-02-03 | |||
| JP2005229033A | 2005-08-25 | |||
| JP2005300038A | 2005-10-27 | |||
| JP2005123317A | 2005-05-12 | |||
| JPH1137678A | 1999-02-12 | |||
| JPH0599580A | 1993-04-20 | |||
| JP2004353902A | 2004-12-16 |
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