Title:
COOLING SYSTEM, SEMICONDUCTOR MANUFACTURING SYSTEM, ETCHING METHOD AND DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2023066287
Kind Code:
A
Abstract:
To provide a cooling system in which a temperature control target can be effectively cooled by a cooling liquid cooled by a natural coolant circulated by a refrigeration cycle device.SOLUTION: A cooling system S1 comprises: a refrigeration cycle device 10 which circulates a natural coolant; a first cooling liquid circulation device 20 which circulates a first cooling liquid cooled by the natural coolant; and a second cooling liquid flowing device 30 which circulates a second cooling liquid via a temperature control target. The refrigeration cycle device 10 and the first cooling liquid circulation device 20 are connected by a first heat exchanger 40. The first cooling liquid circulation device 20 and the second cooling liquid flowing device 30 are connected by a second heat exchanger 50. The second cooling liquid flowing device 30 includes a supply valve device 301 which receives a lower-temperature second cooling liquid cooled by the first cooling liquid in the second heat exchanger 50 and a higher-temperature second cooling liquid not passing the second heat exchanger 50.SELECTED DRAWING: Figure 1
Inventors:
TAKAYAMA MICHIO
MORIMUNE AYUMI
MORIMUNE AYUMI
Application Number:
JP2021176928A
Publication Date:
May 15, 2023
Filing Date:
October 28, 2021
Export Citation:
Assignee:
SHINWA CONTROLS CO LTD
International Classes:
H01L21/3065; F25B1/00; F25B9/00; G05D23/00
Attorney, Agent or Firm:
Nakamura Yukitaka
Miyajima Manabu
Yukihiro Hotta
Yoshiki Kanagawa
Miyajima Manabu
Yukihiro Hotta
Yoshiki Kanagawa