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Title:
COPLANAR LINE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2010081487
Kind Code:
A
Abstract:

To provide a coplanar line with a small attenuation caused by leakage of electromagnetic waves to a substrate in a millimeter wave band without forming any insulating film between a silicon monocrystalline substrate and a signal line, and to provide a method of manufacturing the coplanar line.

The coplanar line includes: a high resistive silicon substrate 22; a signal line 42 formed on the high resistive silicon substrate; and a pair of grounding conductors 44 formed in positions across the signal line on the high resistive silicon substrate. A concave portion 24 is formed in a main surface 22a side of the high resistive silicon substrate between the signal line and the grounding conductors.


Inventors:
MAKITA TAKEHIKO
Application Number:
JP2008249794A
Publication Date:
April 08, 2010
Filing Date:
September 29, 2008
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H01P3/08; H01L21/3065; H01P1/00; H01P11/00
Domestic Patent References:
JP2001102815A2001-04-13
JP2001077606A2001-03-23
JP2000068714A2000-03-03
JP2001345605A2001-12-14
Attorney, Agent or Firm:
Takashi Ogaki
Hiroyuki Okada