Title:
COPOLYAMIDE FOR HOT MELT ADHESIVE AND ADHESIVE BONDING METHOD
Document Type and Number:
Japanese Patent JPS6232168
Kind Code:
A
Abstract:
Copolyamides made from diprimary aliphatic diamines, aliphatic dicarboxylic acids and optionally benzenedicarboxylic acids and/or aminocarboxylic acids and containing, in an amount from 2 to 25% by weight, based on the total weight of the copolymers, carboxyl- terminated polybutadienes having an mn (number average molecular weight) of from 2,000 to 8,000 and an average of from 1.8 to 2.3 carboxyl groups per molecule are used as hot-melt adhesives.
Inventors:
EEDOUARUTO DE YONGU
HERUMUUTO KUNIPUFU
KAARU HAINTSU HAAPERUTO
HERUMUUTO KUNIPUFU
KAARU HAINTSU HAAPERUTO
Application Number:
JP17398686A
Publication Date:
February 12, 1987
Filing Date:
July 25, 1986
Export Citation:
Assignee:
PLATE BONN GMBH
International Classes:
C08L77/00; C08G69/00; C08G69/26; C08G69/36; C08L7/00; C08L21/00; C09J5/06; C09J177/00; (IPC1-7): C08L13/00; C08L77/00; C09J3/16; C09J5/06
Attorney, Agent or Firm:
Chika Takagi
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