Title:
COPOLYESTER RESIN FOR ADHESIVE AND ADHESIVE USING THE SAME
Document Type and Number:
Japanese Patent JP2001200041
Kind Code:
A
Abstract:
To obtain a copolyester resin for an adhesive improved in wet heat resistance while keeping good adhesion to a polyester film, and an adhesive using the same.
The copolyester resin for an adhesive has a glass transition temperature of at most 30°C and a reduction rate of a number-average molecular weight caused by wet heat treatment at a temperature of 85°C, at a humidity of 95% and for a period of 500 h is less than 35%.
Inventors:
OWAKI TAKAMASA
HATA KIYOMI
HATA KIYOMI
Application Number:
JP2000007911A
Publication Date:
July 24, 2001
Filing Date:
January 17, 2000
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08G63/672; C09J167/06; (IPC1-7): C08G63/672; C09J167/06
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