Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPOLYMER COMPOSITION AND MOLDED ARTICLE FOR HEAT RADIATION
Document Type and Number:
Japanese Patent JP2007039671
Kind Code:
A
Abstract:

To provide a resin composition which is excellent in thermal conductivity, generates only a small amount of volatile components by heating and suppresses the formation of chips during extrusion, and to provide a resin sheet and a molded article for heat radiation using the same.

The copolymer composition comprises a flexible styrenic resin comprising a hydrogenated copolymer (1) satisfying the following (a)-(d) which is prepared by hydrogenation of a copolymer of a conjugated diene and a vinyl aromatic compound, and/or a modified hydrogenated copolymer (2) satisfying the following (a)-(d) which is prepared by hydrogenation of a copolymer of a conjugated diene and a vinyl aromatic compound and bonded with at least one atomic group having at least one functional group, and zinc oxide (3) having a needle crystal part, wherein (a) the content of a vinyl aromatic hydrocarbon is >50 mass% and ≤90 mass%; (b) the amount of a polymer block comprising a vinyl aromatic hydrocarbon is ≤40 mass%; (c) the weight average molecular weight is 50,000-1,000,000; and (d) 10% or more of a double bond based on a conjugated diene compound is hydrogenated.


Inventors:
MOTOI YASUAKI
SUZUKI KATSUMI
YASUI TAKESHI
Application Number:
JP2006180813A
Publication Date:
February 15, 2007
Filing Date:
June 30, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L25/10; C08F8/00; C08K3/22; C08L53/02