Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPOLYMER FOR PRODUCTION OF POSITIVE PHOTORESIST AND CHEMICALLY AMPLIFIED POSITIVE PHOTORESIST COMPOSITION CONTAINING THE SAME
Document Type and Number:
Japanese Patent JP2873288
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To make it possible to obtain a quarter-micron or more finer pattern and to improve etching resistance by specifying the standard molecular weight (in terms of the polystyrene) of a copolymer having specified recurring units.
SOLUTION: The basic resin for the production of a positive photoresist is a copolymer comprising recurring units represented by formula I (wherein R is H or an alkyl; k, m and n are the numbers of the recurring units of the respective types, 0.1≤k/(m+n)≤0.5, 0≤m/(k+n)≤0.5, and 0.1≤n/(k+m)≤0.9). This copolymer is obtained by copolymerizing a monomer of formula II with a norbornene monomer of formula III and a maleic anhydride monomer of formula IV in the presence of a polymerization catalyst. In formula II, R is H or an alkyl. This copolymer has an average molecular weight of 1,000-1,000,000, desirably 5,000-40,000 (in terms of the polystyrene). The polymerization reaction for producing the polymer of formula I is desirably radical polymerization using a radical polymerization initiator.


Inventors:
PAAKU JOO HEON
KIMU JIIPPON
KIMU KIIDAE
PAAKU SUNNI
KIMU SEONNJU
Application Number:
JP9648298A
Publication Date:
March 24, 1999
Filing Date:
April 08, 1998
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KUNHO SEOKYU HOAHAKU JUSHIKUHESA
International Classes:
C08F222/06; C08F232/04; C08F232/08; G03F7/004; G03F7/039; (IPC1-7): C08F232/04; C08F222/06; G03F7/004; G03F7/039
Attorney, Agent or Firm:
Takashi Ishida (4 others)