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Title:
COPOLYMER RESIN, ITS PRODUCTION, PHOTORESIST CONTAINING THE COPOLYMER RESIN, ITS PRODUCTION AND SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JP3957409
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain the subject resin having physical properties allowing the use as a copolymer resin for photoresist by copolymerizing two specific kinds of monomers in such a manner as to form a copolymer having a specific structure and improved adhesivity, etc.
SOLUTION: The objective copolymer resin having the structure of the formula (R1 is a 1-10C primary, secondary or tertiary aliphatic alcohol) is produced by copolymerizing (A) an aliphatic cycloolefin monomer and (B) a maleimide monomer. The component A is preferably t-butyl-5-norbornene-2-carboxylate, 5-norbornene-2-carboxylic acid, maleic anhydride, vinylene carbonate, etc., and the component B is preferably N-(2-hydroxyethyl)-maleimide, N-(3- hydroxypropyl)-maleimide, etc.


Inventors:
Chung Zhao Chang
Application Number:
JP24036898A
Publication Date:
August 15, 2007
Filing Date:
August 26, 1998
Export Citation:
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Assignee:
HYNIX SEMICONDUCTOR INC.
International Classes:
C08F222/40; C07D207/448; G03F7/004; C08F2/06; C08F220/52; C08F222/06; C08F232/00; C08F232/08; G03F7/039; (IPC1-7): C08F222/06; C08F2/06; C08F232/08; G03F7/004; G03F7/039; //C07D207/448
Domestic Patent References:
JP2146045A
JP7206939A
JP2000508080A
JP5297591A
JP10198035A
JP10207070A
JP10130340A
Attorney, Agent or Firm:
Hiroshi Arafune
Yoshio Arafune