COPOLYMERIZATION POLYAMIDE COMPOSITION AND MOLDED ARTICLE

Japanese Patent JP2014015553

A

To provide a copolymerization polyamide composition and a molded article having low molding condition dependence and excellent productivity, and excellent in rigidity after water absorption (water absorption rigidity) and appearance.

A polyamide resin composition contains (A) a copolymerized polyamide containing (a) an alicycle dicarboxylic acid unit, (b) a diamine unit having 8 or more carbon atoms, (c) at least one kind of a copolymerization component unit from following (c-1) to (c-3), (c-1) a dicarboxylic acid other than the alicycle dicarboxylic acid of above (a), (c-2) a diamine having less number of carbon atoms than the diamine of above (b), (c-3) lactam and/or an amino carboxylic acid, and satisfying a given requirement in terms of a crystallization peak temperature T_pc-1, a glass transformation temperature T_g, a ratio of the number of carbon atoms and the number of amide groups (the number of carbon atoms/the number of amide groups), a melting peak temperature T_pm and a melting peak temperature T_pm-1, and (B) at least one moldability modifier selected from a group consisting of a higher fatty acid, a higher fatty acid metal salt, a higher fatty acid ester and a higher fatty acid amide.

HINOTO YU
IEDA SHINJI

JP2012154761A

January 30, 2014

July 10, 2012

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ASAHI KASEI CHEMICALS CORP

C08L77/06; C08G69/26; C08K5/09; C08K5/10; C08K5/20

JP2004123773A	2004-04-22
JPH1142666A	1999-02-16
JPS582327A	1983-01-07
JP2011524929A	2011-09-08
JP2011219697A	2011-11-04
JP2004123773A	2004-04-22
JPH1142666A	1999-02-16
JPS582327A	1983-01-07
JP2011524929A	2011-09-08

WO2008149862A1	2008-12-11
WO2009113590A1	2009-09-17
WO2002048239A1	2002-06-20
WO2008149862A1	2008-12-11

Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito

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