Title:
COPOLYMERIZED POLYESTER RESIN AND RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH03252419
Kind Code:
A
Abstract:
PURPOSE:To obtain the subject resin having low discoloration tendency and excellent flexibility, heat-resistance and gas-barrierness and giving a film having high heat-sealability by the polycondensation reaction of terephthalic acid, etc., with a specific alkylene glycol and a specific dimer diol. CONSTITUTION:The objective resin giving a film suitable as a packaging material, especially for refrigeration storage, is produced by the polycondensation reaction of (A) terephthalic acid or a dialkyl terephthalate (preferably dimethyl terephthalate) with (B) one or more kinds of 2-6C alkylene glycol (preferably 1,4-butylene glycol) and (C) preferably 5-10mol% (based on the terephthalic acid or its dialkyl ester) of a dimer diol composed mainly of a compound of formula (R1 and R2 are alkyl; R3 and R4 are alkylene; the total number of carbon atoms of R1 to R4 is 22-34).
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Inventors:
NAKANE TOSHIO
KONUMA HIROAKI
HIJIKATA KENJI
KONUMA HIROAKI
HIJIKATA KENJI
Application Number:
JP5142590A
Publication Date:
November 11, 1991
Filing Date:
March 02, 1990
Export Citation:
Assignee:
POLYPLASTICS CO
International Classes:
C08G63/199; C08J5/18; C08K3/00; C08K5/00; C08L67/00; C08L67/02; (IPC1-7): C08G63/199; C08J5/18; C08K3/00; C08K5/00; C08L67/02
Attorney, Agent or Firm:
Kaoru Furuya