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Title:
Copper alloy board material, a connector, and a manufacturing method of copper alloy board material
Document Type and Number:
Japanese Patent JP5916964
Kind Code:
B2
Abstract:
[Problem] To provide a copper alloy sheet material, a connector that utilizes the copper alloy sheet material, and a method for manufacturing the copper alloy sheet material, said copper alloy sheet material achieving excellent bending workability and wear resistance by appropriate regulation of a waviness motif average length (AW) and a waviness motif average depth (W), that is, indices of microscopic unevenness of a sheet material surface, and being suitable as a material for lead frames, connectors, terminals, and so forth for electric/electronic devices as well as such automobile onboard components as connectors/terminals, relays, switches, and sockets.. [Solution] A copper alloy sheet material, a connector that utilizes the copper alloy sheet material, and a method for manufacturing the copper alloy sheet material, the copper alloy sheet material containing 1.00-6.00% by mass of Ni, 0.10-2.00% by mass of Si, and the balance copper and inevitable impurities, wherein the sheet material surface has a waviness motif average length (AW) of 5.00µm or greater and a waviness motif average depth (W) of 0.50µm or greater.

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Inventors:
Takemi Isomatsu
Yu Higuchi
Application Number:
JP2015534301A
Publication Date:
May 11, 2016
Filing Date:
March 24, 2015
Export Citation:
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Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C22C9/10; C22C9/06; C22F1/08; H01B1/02; H01B5/02; H01B13/00
Domestic Patent References:
JP2000015331A2000-01-18
JPH0673516A1994-03-15
JPH07227620A1995-08-29
JPS6386838A1988-04-18
JP2000015331A2000-01-18
JPH0673516A1994-03-15
JPH07227620A1995-08-29
Foreign References:
WO2012081573A12012-06-21
WO2011125264A12011-10-13
WO2003076672A12003-09-18
WO2012081573A12012-06-21
WO2011125264A12011-10-13
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae



 
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