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Title:
COPPER ALLOY FOR CONNECTOR, AND ITS PRODUCING METHOD
Document Type and Number:
Japanese Patent JP2001303159
Kind Code:
A
Abstract:

To produce a copper alloy having simultaneously various characteristics (that is excellent in strength, electric conductivity, Youung's modulus, press formability, cost or the like) required for the material for electrical and electronic parts such as a connector, and to provide its producing method.

The copper alloy material having a composition containing Ni, P, Zn and Sn in the ranges of, by weight, 20 to 41% Zn, 0.1 to 4.0% Sn, 0.1 to 5.0% Ni and 0.01 to 0.3% P also so as to satisfy the following inequalities of 5.0≤Ni/P≤50; wherein Ni: the content (wt.%) of Ni, and P: the content (wt.%) of P and 6.0≤0.25X+Y≤12; wherein X: the content (wt.%) of Zn, and Y: the content (wt.%) of Sn, and the balance Cu with inevitable impurities is heat-treated at 300 to 750°C for 1 to 360 min, then cold-worked at a working ratio of ≥10% and heat-treated at 200 to 600°C for 5 sec to 180 min. Thus the objective copper whose tensile strength in the rolling direction is ≥600 N/mm2, electric conductivity is ≥18% IACS, Young's modulus is ≤120 kN/mm2 and spring critical value is ≥450N/mm2 can be produced.


Inventors:
TOMOHARA KUNIHIKO
RYO RAKU
SUGAWARA AKIRA
Application Number:
JP2000127182A
Publication Date:
October 31, 2001
Filing Date:
April 27, 2000
Export Citation:
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Assignee:
DOWA MINING CO
International Classes:
C22F1/08; C22C9/04; C22F1/00; (IPC1-7): C22C9/04; C22F1/08
Attorney, Agent or Firm:
Kazuki Asaga