PURPOSE: To improve the electromagnetic wave shielding property of the injec tion moldings and to prevent the deterioration of the electromagnetic wave shielding property in the use for a long period of time by specifying the content of Zn, Ni, Co, Si and Ti in the copper alloy fiber.

CONSTITUTION: The compsn. of the alloy fiber for adding to a conductive resin is constituted of, by weight, 5 to 45% Zn, total 0.1 to 2.0% of one or more kinds among Ni, Co, Si and Ti and the balance Cu with inevitable impurities. Furthermore, the bundle of the copper alloy fibers having the above compsn. is admixed to integrate with low m.p. metal such as Su and Pb, which is regulat ed as a copper alloy fiber bundle for adding to a conductive resin. These fiber bundles are added to a thermoplastic resin for the housing of electric and elec tronic apparatus or the like and injection molding is executed, so that the moldings in which electromagnetic wave faults can efficiently be dissolved even if used for a long period of time can be obtd.