To prevent intergranular cracks at the time of hot rolling in a Cu-Fe alloy used for electrical and electronic parts by refining the cast structure of the copper alloy.

The copper alloy having a composition containing, by weight, 1.5 to 2.5% Fe, 0.001 to 0.1% P and 0.01 to 1.0% Zn, further containing one or two kinds of elements selected from V, Cr, Nb and Mo by 10 to 200 ppm in total, and the balance Cu with inevitable impurities is cast to obtain a cast structure exceedingly finer than that of the conventional Cu-Fe alloy. Its electrical conductivity, strength and elongation are almost equal to those of the conventional alloy, and intergranular cracks at the time of hot rolling are remarkably reduced. A thin strip produced by the same alloy is free from surface defects and can correspond to various precise and fine working, thus can be applied to various electrical and electronic parts including a lead frame for a semiconductor device.