Title:
COPPER ALLOY MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2012122095
Kind Code:
A
Abstract:
To provide a copper alloy material for electric and electronic components that stably suppresses growth of an intermetallic compound and increases reliability of solder joining.
The copper alloy material for electric and electronic components includes 0.05-0.5 mass% of Fe, 0.05-0.5 mass% of Ni, 0.02-0.2 mass% of P, 0.1-3 mass% of Zn, and 0.02-0.3 mass% of Sn, and the remainder includes Cu and inevitable impurities. The mass ratios of the components have the following relations: (Fe+Ni)/P=(3 to 10), Fe/Ni=(0.8 to 1.2), Zn/(Fe+Ni)≥0.5, and Sn/(Fe+Ni)≤0.5.
Inventors:
YAMAMOTO YOSHINORI
HAGIWARA NOBORU
HAGIWARA NOBORU
Application Number:
JP2010273454A
Publication Date:
June 28, 2012
Filing Date:
December 08, 2010
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
C22C9/04; C22C9/00; C22C9/02; C22C9/06
Domestic Patent References:
| JPH1112714A | 1999-01-19 | |||
| JP2005048225A | 2005-02-24 | |||
| JP2005029826A | 2005-02-03 | |||
| JP2009242822A | 2009-10-22 | |||
| JP2008024995A | 2008-02-07 | |||
| JP2008095125A | 2008-04-24 |
Attorney, Agent or Firm:
Tadao Hirata
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Now Satoshi
Kenji Tsunoda
Yuji Iwanaga
Keiko Nakamura
Endo Wako
Takashi Nomiyama
Now Satoshi