To provide a copper alloy material for electronic and electrical apparatus parts jointly having excellent mechanical properties, conductivity, stress relaxation properties, bending workability and plating properties, particularly, a copper alloy material for electronic and electrical apparatus parts having excellent plating properties and suitable for a terminal and a connector.
The copper alloy material for a terminal or a connector having excellent mechanical strength, conductivity, stress relaxation properties, bending workability and the preventability of deterioration in plating has a composition comprising, by mass, 1.0 to 3.0% Ni, 0.2 to 0.7% Si, 0.01 to 0.2% Mg, 0.05 to 1.5% Sn, 0.2 to 1.5% Zn and <0.005% (including zero) S, and the balance Cu with inevitable impurities. After final plastic working, the surface roughness Ra is >0 to <0.1 μm, or, the surface roughness Rmax is >0 to <2.0 μm, Sn or Sn alloy plating is applied thereto, the thickness of the Sn or Sn alloy plating is 0.1 to 10 μm, the stress relaxation ratio after being kept for 1,000 hr at 150°C is ≤20%, and at the time when 180° bending is performed at the inside bending radius of 0 mm, cracks are not generated.
HIRAI TAKAO
Wataru Sasaki
Naosuke Miyamae
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