To provide a titanium copper having superior strength and bendability and to provide a method for producing the titanium copper.

The copper alloy for electronic parts contains 2.0 to 4.0 mass% Ti, and the balance copper with inevitable impurities, wherein the half-value width β{220} of X-ray diffraction intensity from {220} crystal plane on a rolled surface satisfies the following relation with the half-value width β0{220} of X-ray diffraction intensity from {220} crystal plane of pure copper standard powder; 1.5≤β{220}/β0{220}≤3.0, and X-ray diffraction intensity I from {220} crystal plane on the rolled surface satisfies the following relation with the X-ray diffraction intensity I0 from {220} crystal plane of pure copper standard powder; 4.0≤I{220}/I0{220}≤7.0.