PURPOSE: To decrease the deformation of a packing plate due to thermal strain, to enable repeated utilization the plate and to obtain good thermal conductivity and brazing property by specifying the amts. of Cr and Te in a copper alloy for packing plates.

CONSTITUTION: The copper alloy for packing plates consists of, by wt.% 0.05-0.3% Cr, 0.001-0.02% Te, the balance Cu, and inevitable impurities. Further as necessary, one or more elements of 0.01-1.0% Zn, 0.01-2.5% Sn, 0.001-0.5% Mg, 0.01-1.0% Co, 0.01-0.5% Ni, and 0.01-4.0% Pb are incorporated into the alloy. Since Cr is dispersed as a precipitate in the alloy, it acts to increase the alloy strength without causing much reduction of thermal conductivity and to suppress the deformation due to thermal strain. Te acts as a deoxidizing agent, and by the coexistance with Cr, Te improves the strength and the heat resistance of the alloy. Moreover, by incorporating the additional elements, casting property, strength and machinability can be improved.