To provide a copper alloy excellent in strength and bendability, a copper rolled product, an electronic component and a connector.

The copper alloy comprises 2.0-4.0 mass% Ti, 0-0.5 mass% in total of one or more chosen from the group consisting of Mn, Fe, Mg, Co, Ni, Cr, V, Mo, V, Nb, Zr, Si, B and P, as a third element, and the balance being copper and inevitable impurities. When the titanium concentration in a base phase of the copper alloy for electronic components is observed using a scanning transmission electron microscope, the amplitude Y (wt.%) of the Ti concentration in the base phase in a cross section parallel to the rolling direction of the copper alloy and the Ti concentration X (wt.%) in the copper alloy for electronic components satisfy the relation: (0.83X-0.65)<Y<(0.83X+0.50).