To provide a titanium copper excellent in strength and bendability, a copper rolled product, an electronic component, a connector and a method for manufacturing the titanium copper.

The copper alloy comprises 2.0-4.0 mass% Ti, 0-0.2 mass% in total of at least one third element chosen from the group consisting of Mn, Fe, Mg, Co, Ni, Cr, V, Nb, Mo, Zr, Si, B and P and the balance being copper and inevitable impurities. When the X-ray diffraction strength of a rolling surface of the copper alloy is measured, the ratios (I/I0) of the X-ray diffraction strength I of the rolling surface to the X-ray diffraction strength I0 of a pure copper powder of planes (311) and (200) satisfy the relation: {I/I0(311)}/{I/I0(200)}≤2.54, and the ratios (I/I0) of the X-ray diffraction strength I of the rolling surface to the X-ray diffraction strength I0 of the pure copper powder of planes (220) and (200) satisfy the relation: 15≤{I/I0(220)}/{I/I0(200)}≤95.