Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPPER ALLOY, COPPER ROLLED PRODUCT, ELECTRONIC COMPONENT AND CONNECTOR USING THE SAME, AND METHOD FOR MANUFACTURING COPPER ALLOY
Document Type and Number:
Japanese Patent JP2012097307
Kind Code:
A
Abstract:

To provide a titanium copper excellent in strength and bendability, a copper rolled product, an electronic component, a connector and a method for manufacturing the titanium copper.

The copper alloy comprises 2.0-4.0 mass% Ti, 0-0.2 mass% in total of at least one third element chosen from the group consisting of Mn, Fe, Mg, Co, Ni, Cr, V, Nb, Mo, Zr, Si, B and P and the balance being copper and inevitable impurities. When the X-ray diffraction strength of a rolling surface of the copper alloy is measured, the ratios (I/I0) of the X-ray diffraction strength I of the rolling surface to the X-ray diffraction strength I0 of a pure copper powder of planes (311) and (200) satisfy the relation: {I/I0(311)}/{I/I0(200)}≤2.54, and the ratios (I/I0) of the X-ray diffraction strength I of the rolling surface to the X-ray diffraction strength I0 of the pure copper powder of planes (220) and (200) satisfy the relation: 15≤{I/I0(220)}/{I/I0(200)}≤95.


Inventors:
Horie, Hiroyasu
Era, Naohiko
Application Number:
JP2010000244794
Publication Date:
May 24, 2012
Filing Date:
October 29, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22C9/00; C22F1/08; H01B1/02; H01B5/02; H01B13/00; C22F1/00; C22F1/02
Domestic Patent References:
JP2007270267A2007-10-18
JP2009242881A2009-10-22
JP2008081767A2008-04-10
Attorney, Agent or Firm:
アクシス国際特許業務法人