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Title:
COPPER ALLOY SHEET MATERIAL AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2015120949
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper alloy sheet material low in Young modulus in a TD direction, having high bearing force in the TD direction, excellent in fatigue resistance and suitable for a lead fame, a connector, terminal materials or the like for electric and electronic apparatus, a connector, other terminal materials, a relay, a switch, a socket or the like for automobile on-vehicle.SOLUTION: There is provided a copper alloy sheet material containing Ni of 1.0 to 5.0 mass%, Si of 0.1 to 2.0 mass% and at least one kind of B, Mg, P, Cr, Mn, Fe, Co, Zn, Zr, Ag and Sn of total 0 to 3.0 mass% and the balance copper with inevitable impurities and having 0.030/μmor less of density of crystal particles having aspect ratio represented by a ratio of minor axis/major axis of crystal particle of 0.3 or less by analysis on a rolling face and facing within ±30° from the TD direction and 0.8 μm/μmor less of length per unit area of a crystal particle boundary having a deviation angle between neighboring crystal particles of 30° or more.

Inventors:
ISOMATSU TAKEMI
KANEKO HIROSHI
HIROSE KIYOSHIGE
EGUCHI TATEHIKO
Application Number:
JP2013264422A
Publication Date:
July 02, 2015
Filing Date:
December 20, 2013
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C22C9/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; C22C9/10
Domestic Patent References:
JP2013163853A2013-08-22
JP2013040389A2013-02-28
JP2015034328A2015-02-19
Other References:
古河電気工業: "高性能コネクタ用銅合金 EFCUBE-STの開発", 古河電工時報, JPN6017019817, July 2012 (2012-07-01), pages 15 - 16, ISSN: 0003568989
Attorney, Agent or Firm:
Toshizo Iida
Naosuke Miyamae