Title:
COPPER ALLOY WIRE MATERIAL FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2005116486
Kind Code:
A
Abstract:
To provide a copper alloy wire material for electronic components reconciling strength and conductivity with good balance as a connector.
A covering layer made of copper-zinc alloy is formed on an outer periphery of a core material made of copper or a copper alloy, and a ratio (B/A) of a cross section area (B) of the wire material against a cross section area (A) of the wire material is to be 0.15 to 0.6.
Inventors:
KURODA HIROMITSU
KIMOTO KUNIAKI
SAWAHATA KATSUNORI
KATO HIROYUKI
KIMOTO KUNIAKI
SAWAHATA KATSUNORI
KATO HIROYUKI
Application Number:
JP2003352835A
Publication Date:
April 28, 2005
Filing Date:
October 10, 2003
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
B21C1/00; C22C9/02; C22C9/04; C25D7/06; H01B5/02; H01R13/03; (IPC1-7): H01B5/02; B21C1/00; C22C9/02; C22C9/04; C25D7/06; H01R13/03
Attorney, Agent or Firm:
Tadao Hirata
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