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Patent Searching and Data


Title:
COPPER ALLOY
Document Type and Number:
Japanese Patent JPS63266033
Kind Code:
A
Abstract:

PURPOSE: To develop a Cu alloy having excellent fatigue properties without lowering the mechanical properties and electroconductivity thereof by adding specific amt. of Al to the prior Cu-Ni-Si alloy.

CONSTITUTION: The Cu alloy contg., by weight, 1.5W20% Ni, 0.3W1.5% Si and 0.4W6.0% Al in such a manner that Ni:Al=3W5:1 and Ni:Si=3W5:1 are regulated, or furthermore contg. total 0.04W5.0% of one or more kinds among 0.03W4.0% Zn, 0.03W1.5% Mn, 0.03W0.5% Mg, 0.03W0.7% Ti, 0.03W0.7% Cr, 0.01W0.2% Zr, 0.03W0.7% Fe, 0.01W0.5% P, and 0.001W0.1% B is used as the Cu alloy for a member of a switch, relay, etc., to which repeated stress is applied. In this way, fine compounds such as NiAl, Ni2Al3, etc., including Ni2Si are deposited in a matrix and the fatigue properties of the titled alloy by repeated load are improved.


Inventors:
HASHIZUME KIMIO
ITO TAKEFUMI
KUBOZONO KENJI
Application Number:
JP10079287A
Publication Date:
November 02, 1988
Filing Date:
April 23, 1987
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C22C9/06; H01B1/02; (IPC1-7): C22C9/06; H01B1/02
Attorney, Agent or Firm:
Masuo Oiwa