Title:
電子部品用銅系複合基材及び電子部品
Document Type and Number:
Japanese Patent JP3984629
Kind Code:
B2
Abstract:
A copper based composite base material for electronic part, characterized by having a copper based composite base material composed of a copper base material or copper alloy base material having its surface provided with a coating layer of tin or tin based alloy and further having, provided on a surface of the coating layer, a thin film of silicon oxide containing a hydrocarbon group and/or hydroxyl. This copper based composite base material for electronic part, in the instance of sealing or bonding of a substrate of copper based composite base material, etc. with a resin, realizes high adhesion between the base material and components of the resin.
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Inventors:
Yasushi Masago
Kazushi Hayashi
Kazushi Hayashi
Application Number:
JP2005361881A
Publication Date:
October 03, 2007
Filing Date:
December 15, 2005
Export Citation:
Assignee:
KABUSHIKI KAISHA KOBE SEIKO SHO
International Classes:
C23C28/00; B32B15/04; C23C16/40
Domestic Patent References:
| JP63207158A | ||||
| JP2005336554A | ||||
| JP2001279457A | ||||
| JP2002090503A | ||||
| JP2005263832A | ||||
| JP2082645A |
Attorney, Agent or Firm:
Etsushi Kotani
Takao Ito
Jiro Higuchi
Masaru Egawa
Takao Ito
Jiro Higuchi
Masaru Egawa