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Title:
COPPER-BASED SLIDING MATERIAL
Document Type and Number:
Japanese Patent JP2013082958
Kind Code:
A
Abstract:

To provide a copper-based sliding material which has excellent seize resistance by controlling a dispersed state of needle-shaped Mn-Si-based compounds crystallized in a brass structure.

In the copper-based sliding material 1 having the needle-shaped Mn-Si-based compounds 3 dispersed in the brass structure 2, 50% or more of the total number of the needle-shaped Mn-Si-based compounds 3 having a length in the long axis direction of 50 μm or more are composed of a plurality of small particles 4. Thereby, even if the needle-shaped Mn-Si-based compounds 3 fall off during sliding, the small particles 4 which constitute the needle-shaped Mn-Si-based compounds 3 may fall off. Thus, the frequency of falling off of the coarse needle-shaped Mn-Si-based compound 3, which damages a shaft and a bearing, is decreased. Therefore, seizure hardly occurs.


Inventors:
TODA KAZUAKI
KURIMOTO SATORU
Application Number:
JP2011222373A
Publication Date:
May 09, 2013
Filing Date:
October 06, 2011
Export Citation:
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Assignee:
DAIDO METAL CO LTD
International Classes:
C22C9/04; C22C47/00; C22C49/14
Domestic Patent References:
JP2011179600A2011-09-15
Attorney, Agent or Firm:
Kazushi Imasaki
Hiroto Furuta