Title:
COPPER-CARBON FIBER COMPOSITE MATERIAL, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2004285372
Kind Code:
A
Abstract:
To provide a copper-carbon fiber composite material in which the wettability between the carbon fibers and copper is improved without causing the reduction of its thermal conductivity.
In the copper-carbon fiber composite material obtained by incorporating carbon fibers into copper, a composition comprising one or more metallic elements having affinity to both of copper and carbon and carbon obtained by carbonizing organic matter is present in a part or the whole of the surface of each carbon fiber, and copper is filled into the carbon fibers and the region other than the composition.
Inventors:
SONE TAKANORI
OZAWA TAKUO
ITO TAKEFUMI
OZAWA TAKUO
ITO TAKEFUMI
Application Number:
JP2003075935A
Publication Date:
October 14, 2004
Filing Date:
March 19, 2003
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C22C49/14; C22C1/10; C22C47/04; C22C47/06; C22C49/02; C22C101/10; (IPC1-7): C22C49/14; C22C1/10; C22C47/04; C22C47/06; C22C49/02
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai