Title:
フッ素樹脂繊維紙を用いたプリント基板用銅張り板及びその製造方法
Document Type and Number:
Japanese Patent JP3590784
Kind Code:
B2
Abstract:
The invention provides fluororesin fiber paper excellent in adhesion to a copper foil, heat resistance, chemical resistance, low water absorption and electric insulation and capable of being used as a substrate of a printed board suitable for use in high frequency, of which a low dielectric loss is required. The fluororesin fiber paper is a porous sheet obtained by forming a slurry comprising fluororesin fiber into a sheet by a wet paper making method and sintering the resultant sheet and has an average pore diameter of 0.5 to 50 mum and a maximum pore diameter of at most 250 mum. A copper-clad laminate for printed board is produced by laminating the fluororesin fiber paper and a copper foil having a ten point mean height of surface roughness profile (Rz) of 0.5 to 8.0 mum on each other by means of vacuum hot pressing.
More Like This:
| JPS5825951 | MANUFACTURE OF STRATIFIED BOARD |
Inventors:
Takanori Suzuki
Tsuda Tsuda
Tsuda Tsuda
Application Number:
JP2001234365A
Publication Date:
November 17, 2004
Filing Date:
August 02, 2001
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
B32B7/00; B32B15/08; B32B15/082; B32B15/12; B32B15/14; B32B27/30; D21H13/10; D21H13/12; D21H13/14; D21H13/36; D21H13/40; D21H25/04; D21H27/12; D21H27/30; H01B3/52; H05K1/00; H05K1/02; H05K1/03; H05K3/00; D21H17/35; H05K3/02; (IPC1-7): H05K1/03; B32B15/08; D21H13/12
Domestic Patent References:
| JP10195793A | ||||
| JP7109669A | ||||
| JP11144529A | ||||
| JP2000238162A |
Attorney, Agent or Firm:
Mamoru Takeuchi