Title:
COPPER-CLAD LAMINATE AND METHOD FOR PRODUCING COPPER-CLAD LAMINATE
Document Type and Number:
Japanese Patent JP2023005364
Kind Code:
A
Abstract:
To provide a copper-clad laminate with excellent fracture resistance and a method for producing the copper-clad laminate.SOLUTION: A copper-clad laminate 1 comprises a base material 10, and a copper plating film 20 formed on a surface of the base material 10. The copper plating film 20 includes: a lower layer 21 formed on the surface of the base material 10; an intermediate layer 22 formed on a surface of the lower layer 21 by electroplating at a low current density; and a surface layer 23 formed on the surface of the intermediate layer 22. Since the intermediate layer 22 formed at a low current density is inserted into the copper plating film 20, the fracture resistance of the copper-clad laminate 1 can be improved.SELECTED DRAWING: Figure 1
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Inventors:
NISHIYAMA YOSHIHIDE
Application Number:
JP2021107217A
Publication Date:
January 18, 2023
Filing Date:
June 29, 2021
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
C25D5/56; C25D21/00; H05K1/03; H05K3/00
Attorney, Agent or Firm:
Patent Attorney Corporation Yamauchi Patent Office