COPPER COATING SUPERIOR IN OXIDATION RESISTANCE, FORMING METHOD THEREOF, AND ELECTRONIC COMPONENT THEREWITH

Title:

COPPER COATING SUPERIOR IN OXIDATION RESISTANCE, FORMING METHOD THEREOF, AND ELECTRONIC COMPONENT THEREWITH

Document Type and Number:

Japanese Patent JP2002294488

Kind Code:

A

Abstract:

To provide a copper coating superior in oxidation resistance, a forming method thereof, and electronic components therewith.

The electronic components comprise a lead frame having a copper film superior in oxidation resistance, which is electroplated on a material made of a copper alloy to be plated, such as the lead frame, with the use of a copper plating liquid containing copper, KCN, and silver of 0.01% or more against the copper content. The copper film has such superior oxidation resistance as the thickness of the oxidized film which is generated on the surface of the copper film, by means of leaving it on a hot plate of 350°C for 10 minutes in ambient atmosphere and cooling, is only 0.4 μm or thinner when measured with a cathode reduction method.

Inventors:

HIRAOKA YUKIO
ITO MASAKI
SHIMADA SUSUMU

Application Number:

JP2001094774A

Publication Date:

October 09, 2002

Filing Date:

March 29, 2001

Export Citation:

Click for automatic bibliography generation Help

Assignee:

DOWA MINING CO

International Classes:

C25D3/56; C25D3/58; C25D7/00; (IPC1-7): C25D7/00; C25D3/56; C25D3/58

Domestic Patent References:

JPH01257356A	1989-10-13
JPH08241947A	1996-09-17

Attorney, Agent or Firm:

Maruoka Masahiko

Previous Patent: Sn PLATED MATERIAL

Next Patent: VASE AND TOOL FOR FLOWER ARRANGEMENT, AND SURFACE TREATMENT METHOD THEREFOR