Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COPPER COMPOUND, RAW MATERIAL FOR FORMING THIN FILM AND METHOD FOR PRODUCING THIN FILM
Document Type and Number:
Japanese Patent JP2015218117
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a copper compound which has a low melting point, can be transported in a liquid state, has a high vapor pressure and can be vaporized readily; and a raw material for forming a thin film using the copper compound.SOLUTION: There is provided a copper compound represented by the following general formula (I). (wherein, Rto Reach independently represents a straight or branched chain alkyl group having 1 to 5 carbon atoms; provided when Rand Rare a methyl group, Rrepresents a straight or branched chain alkyl group having 2 to 5 carbon atoms; and when Ris a methyl group and Ris an ethyl group, Rrepresents a straight or branched chain alkyl group having 3 to 5 carbon atoms.) In addition, the raw material for forming a thin film contains a copper compound represented by the above general formula (I).

Inventors:
YOSHINO TOMOHARU
ENZU MASAKI
SAKURAI ATSUSHI
NISHIDA AKIHIRO
OKABE MAKOTO
Application Number:
JP2014100611A
Publication Date:
December 07, 2015
Filing Date:
May 14, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ADEKA CORP
International Classes:
C07F1/08; C23C16/18; H01L21/28; H01L21/285
Domestic Patent References:
JP2008537947A2008-10-02
Foreign References:
US20130330473A12013-12-12
US6822107B12004-11-23
Other References:
BECKER, RALF ET AL.: "A study on the metal-organic CVD of pure copper films from low cost copper(II) dialkylamino-2-propox", CHEMICAL VAPOR DEPOSITION, vol. 9(3), JPN6015026365, 2003, pages 149 - 156, ISSN: 0003667697
Attorney, Agent or Firm:
Michiharu Soga
Kajinami order
Kazuhiro Oyaku
Satoshi Iino