PURPOSE: To increase adhesion between a metal film and a board, decrease electric resistance of the metal film, enhance thermal shock resistance, and enhance working capability after plating by using a specific polymer composite and mixed copper powder.
CONSTITUTION: A polymer composite is mixed to an organic solvent and dissolved, very fine particles of copper oxide are uniformly dispersed in the dissolved solvent, mixed copper powder or a mixture of the mixed powder and glass powder are added to the dispersed solution, they are mixed and stirred, then they are uniformly mixed with an ink roll. The mixed copper powder consists of main copper powder with a mean particle diameter of 1-10μm and at least one kind of auxiliary copper powder with a mean particle diameter smaller than that of the amin copper powder. The weight ratio of the mixed copper powder to copper oxide in the polymer composite is limited to 5-50 to 1 of the copper oxide, and the total amount of copper oxide and mixed copper powder is limited to 50-90wt.% based on the weight of the conductive paste. Adhesion between a conductive film and a board is increased and electric resistance of the conductive film is decreased, and thermal shock resistance is also increased.
NOGUCHI TORU
YAMAGUCHI YOSHIO
YAMASHITA YOSHIFUMI
NOGAMI YOSHITO
OKUNO CHEM IND CO
| JPH0598195A | 1993-04-20 | |||
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