Title:
COPPER CONDUCTOR PASTE FOR ALUMINUM NITRIDE BOARD, AND ALUMINUM NITRIDE BOARD
Document Type and Number:
Japanese Patent JP3756283
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper conductor paste which adheres satisfactorily even to an aluminum nitride board and provide such an aluminum nitride board using the copper conductor paste.
SOLUTION: Particulates are formed from copper, copper oxide, or mixture thereof whose mean particle size ranges between 1-500 nm, and a mixture copper powder is prepared by adding to the particulates the base copper powder as chief component with the mean perticle size ranging between 0.5-10 μm and one sort or more of aux. copper powder having a smaller mean particle size, and therefrom a copper conductor paste is formed together with a binder resin, glass powder, and organic solvent, wherein the binder resin should consist of a resin having at least a pyrolytic temp. of 250-350°C, and the glass powder has a softening point lower than the sintering point of the particulates or mixture copper powder and higher than the decomposing temp. of the binder resin.
Inventors:
Yusei Yagyu
Masato Kawahara
Toru Noguchi
Masato Kawahara
Toru Noguchi
Application Number:
JP9836797A
Publication Date:
March 15, 2006
Filing Date:
March 31, 1997
Export Citation:
Assignee:
Mitsuboshi Belting Co., Ltd.
International Classes:
H01B1/16; H05K1/09; H01B5/12; H05K1/11; (IPC1-7): H01B1/16; H01B5/12; H05K1/09; H05K1/11
Domestic Patent References:
| JP8017241A |