Title:
Me-DLC硬質材料コーティングを備えた銅含有導電性材料
Document Type and Number:
Japanese Patent JP2008506036
Kind Code:
A
Abstract:
The invention relates to a conductive material consisting of an alloy that contains copper, for use as a plug-in or clip connection. Said material comprises a cover layer that is deposited on at least some sections of the contact surface, said layer consisting at least of a support layer and an adhesive layer. The anti-friction layer has a carbon content greater or less than 40 and less than or equal to 70 atomic percent.
Inventors:
Jabs, Thomas
Schalf, Michael
Griske, Martin
Marsell, Orraf
Schalf, Michael
Griske, Martin
Marsell, Orraf
Application Number:
JP2007519589A
Publication Date:
February 28, 2008
Filing Date:
June 15, 2005
Export Citation:
Assignee:
OC Oerlikon Balzers AG
WIELAND-WERKE AG
WIELAND-WERKE AG
International Classes:
C23C14/06; C22C26/00; C23C14/34; C23C16/02; C23C16/26; H01H1/02; H01H1/04; H01H11/04
Domestic Patent References:
| JP2002025346A | 2002-01-25 | |||
| JPH06212429A | 1994-08-02 | |||
| JPH1149506A | 1999-02-23 | |||
| JPS62218549A | 1987-09-25 | |||
| JPH10241479A | 1998-09-11 |
Foreign References:
| WO1999060183A1 | 1999-11-25 |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai