COPPER ELECTRODEPOSITION IN MICRO ELECTRONICS

Japanese Patent JP2022095629

A

To provide an electroplating composition and a method of using the same for performing a super filling of a submicron feature in a semiconductor integrated circuit device.SOLUTION: A composition includes: (a) a copper ion source for electrolyzing and depositing copper on a substrate and in an electrical interconnection feature; and (b) an inhibitor including at least three amine moieties. The polyether includes a block copolymer substituent including a propylene oxide (PO) recurring unit and an ethylene oxide (EO) recurring unit. The number-average molecular weight of the inhibitor compound is about 1,000-20,000.SELECTED DRAWING: Figure 1

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VINCENT PANECCASIO JR
KYLE WHITTEN
RICHARD HURTUBISE
JOHN COMMANDER
ERIC ROUYA

JP2022036289A

June 28, 2022

March 09, 2022

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MACDERMID ENTHONE INC

C25D3/38; C08G65/333; C25D5/02; C25D5/56; H01L21/288; H01L21/3205

JP2008519908A	2008-06-12
JP2012522898A	2012-09-27
JP2012510179A	2012-04-26
JP2013091850A	2013-05-16

WO2015077772A1

2015-05-28

Tadashige Ito
Tadahiko Ito
Koichi Hirota
Yoshihiro Ryu
Naoko Matsuda

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