Title:
COPPER FINE PARTICLE, METHOD FOR PRODUCING COPPER FINE PARTICLE, INSULATION MATERIAL, STRUCTURE OF ELECTRIC WIRING, METHOD FOR MANUFACTURING ELECTRIC WIRING CIRCUIT-BOARD, AND ELECTRONIC/ELECTRICAL EQUIPMENT
Document Type and Number:
Japanese Patent JP2008088518
Kind Code:
A
Abstract:
To provide copper fine particles (nanoparticles) which show high dispersibility in spite of having sizes of a nanometric order.
A method for producing the copper fine particles comprises: a primary reduction step of mixing a solution of an unsaturated fatty acid containing copper ions with a solution of an aldose (reductive monosaccharide) to form an emulsion thereof; a secondary reduction step of adding an aqueous solution of ascorbic acid to the emulsion; and a step of separating the copper fine particles. Thereby obtained copper fine particles have an average particle diameter of 100 nm or less. The copper fine particle has one part or all of the surface modified with carboxylic terminal groups of the unsaturated fatty acid.
Inventors:
BESSHO TAKESHI
YANAGIMOTO HIROSHI
OKIDO MASAZUMI
ICHINO RYOICHI
YANAGIMOTO HIROSHI
OKIDO MASAZUMI
ICHINO RYOICHI
Application Number:
JP2006272120A
Publication Date:
April 17, 2008
Filing Date:
October 03, 2006
Export Citation:
Assignee:
TOYOTA MOTOR CORP
OKIDO MASAZUMI
ICHINO RYOICHI
OKIDO MASAZUMI
ICHINO RYOICHI
International Classes:
B22F1/054; B22F1/102; B22F9/24; H05K1/09; H05K3/10; H05K3/40; H01B1/00; H01B3/00
Domestic Patent References:
| JP2004225122A | 2004-08-12 | |||
| JP2004176147A | 2004-06-24 |
Attorney, Agent or Firm:
Yusuke Hiraki
Ishii Teiji
Satoshi Fujita
Tsuruhiko Sekiguchi
Ishii Teiji
Satoshi Fujita
Tsuruhiko Sekiguchi