Title:
Copper fine particles and their manufacturing method
Document Type and Number:
Japanese Patent JP6316683
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper fine particle material capable of low temperature sintering and also excellent in oxidation resistance.SOLUTION: Provided is a copper fine particle material satisfying all the following conditions: (1), in the particle size distribution based on number based on the observed image of an electron field release type scanning electron microscope, the particles of 60 nm or lower being 80 to 95 piece%; (2) the material is sintered by being heated at 150°C or lower in a nitrogen atmosphere and shows electric conductivity; and (3) the peak derived from copper oxide is not detected in powder X-ray diffraction measurement even after being exposed to the air for 3 months in an environment of 25°C×60RH% in a state of being dispersed into ethanol. In suitable one embodiment, a particle size volume distribution obtained by expressing the particle size distribution on the base number into a volume standard has bimodality, the first peak top lies in the range of 20 to 55 nm, and the second peak top lies in the range of 60 to 100 nm.
Inventors:
Kikukawa Yukiko
GM Anil Kumar
Zhang
Keita Miyajima
GM Anil Kumar
Zhang
Keita Miyajima
Application Number:
JP2014137632A
Publication Date:
April 25, 2018
Filing Date:
July 03, 2014
Export Citation:
Assignee:
Noritake Company Limited
International Classes:
B22F1/00; B22F9/24; H01B5/00; H01B13/00
Domestic Patent References:
| JP2013091835A | ||||
| JP2006176836A | ||||
| JP2012041592A | ||||
| JP2007258123A |
Attorney, Agent or Firm:
Makoto Abe
Michiko Oi
Michiko Oi