To provide a copper foil having excellent bending property when it is used for a copper clad laminate, and the copper clad laminate using the same.

The copper foil has a thickness of 5-30 μm, surface roughness of Ra≤0.1 μm in the rolling parallel direction, and a work-hardening exponent after annealing for 0.5 hour at 350°C is ≥0.3 and ≤0.45, and further the semi-softening temperature being ≤150°C. The copper foil is composed of oxygen-free copper or tough pitch copper and includes one or more kinds of the group of Ag and Sn by ≤500 mass ppm in total in oxygen-free copper or tough pitch copper. Further, the number of times of bending before breakage in the 180° contact-bend by using a sample of the predetermined dimension with a resin layer laminated on one side of the copper foil is at least 4. The total working degree at the final cold rolling is ≥85%, and the copper foil is rolled under the condition of the oil film equivalent in the final three passes, where the oil film equivalent in two pass before the final pass: ≤25,000, the oil film equivalent in one pass before the final pass: ≤30,000, and the oil film equivalent in the final pass: ≤35,000.